Sonda Defines 3-Prong Issuance

Chilean IT company Sonda is shedding more light on its planned UF3m ($124m) bond issue. The issue will have 3 tranches: a 2014 denominated in UF paying about 3.5%; a 2014 in CLP at around 6.0%; and a 2030 in UF at about 4.5%. Proceeds will be used to finance Sonda’s expansion plans and to refinance debt, the company says. Celfin Capital is managing the sale.